We have developed a range of chemicals for each stage of plating, solder dipping, deflashing and etching processes for semiconductor, electronics and automotive industries.
Semiconductor
Soldering Chemicals
- Soldering Flux: Our water based, halide-free, organic solder fluxes do not cause corrosion to the die and reduces the likelihood of leads being soldered together thus preventing short circuits. It also overcomes other shortcomings such as solder lumps, de-wetting, icicles and pin-hole formation.
- Solder Oil: The soldering oil is applied on the surface of the molten solder dipping bath to minimize solder oxide formation and to improve wetting of the surface. It is to ensure that the solder layers formed on the leads are free from impurities.
Deflashing Chemicals
- Immersion/Electrolytic deflashing chemicals: The deflashing chemicals operate in low temperature, halide free, non-flammable and non-corrosive. It is used in immersion dipping and electrolytic processes.
Plating Chemicals
- Pre-treatment chemicals: To remove any organic materials such as dust, oil and fingerprints from the metal surface
- Activation chemicals: To dissolve the oxides on the metal surface
- Pre-dip chemicals: To condition the metal surface for plating
- Plating chemicals: To deposit a layer of metal elements or alloys on the surface of the leads
- Post-treatment chemicals: To clean and neutralize the plated surface
- Stripping chemicals: To strip off the metal alloy or element from the surfaces of carrier belts used in plating
Electronics and Automotive
Plating Chemicals
- Pre-treatment chemicals: To remove any organic materials such as dust, oil and fingerprints from the metal surface
- Activation chemicals: To dissolve the oxides on the metal surface
- Plating chemicals: To deposit a layer of metal elements or alloys on the surface of the leads
- Post-treatment chemicals: To clean and neutralize the plated surface
- Stripping chemicals: To strip off the metal alloy or element from the surfaces of carrier belts used in plating
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