We offer a wide range of chemicals for the plating process for electronics, semiconductor and automotive industries, Including:-
Lead Free Pure Tin Plating Chemistry
- MSA Based solution for deposition of pure tin on lead frame surface.
Solder (Tin/Lead) Plating Chemistry
- MSA Based solution for deposition of tin/lead on lead frame surface.
Electrolytic Nickel Plating Chemistry
- Nickel Sulfamate based solution for deposition of nickel on metal surface.
Immersion Tin Plating Chemistry
- Acid based solution for deposition of pure tin, tin alloy on metal surface.
Immersion Silver Plating Chemistry
- Water based solution for deposition of silver on metal surface.
Immersion Gold Plating Chemistry
- Water based solution for deposition of gold on metal surface.
Electroplating Chemicals for Semiconductor
Pure Tin Plating Chemistry
- Methane Sulfonic Acid
- Stannous Methane Sulfonate
- Plating Additive
Tin-Lead Plating Chemistry
- Methane Sulfonic Acid
- Stannous Methane Sulfonate
- Lead Methane Sulfonate
- Plating Additive
Pure Tin Plating Chemicals – Distinguished Features
- No whisker found after the storage test
- Methane sulfonic acid based chemistry
- Cpk > 2.0 on deposition thickness
- Good visual quality
- High speed deposition rate
- Superior throwing power
- No sludge formation
- No dumping of plating solution even after 5 years
- Suitable for running on different types of equipment
- Good deposition on different types of base materials (Cu, Alloy 42, Ni….)
