AGS specializes in wet process technologies, design and development process, chemicals and equipment for connector, lead frame, semiconductor, automotive and solar cell industries.
Plating is a requisite surface finishing process in the manufacture of electronics and mechanical components . A layer of metal alloy or elements such as solder, tin, gold, silver and nickel is plated on the surface of the components to protect the surface, create an optimal bonding surface or enhance the operating performance of the device. Cleaning in a precise and controlled manner, and is carried out in a series of process baths each under controlled operating conditions of temperature, soaking time, chemical concentration and electrical conditions.
We offer the following systems which are used during the manufacturing process of electronics, semiconductor, and automotive industries .
Electronics
Reel-to-reel plating system for lead frames
Selective plating is used where only pre-defined areas are to be plated. As plating employs expensive materials such as silver, gold and nickel, selective plating minimizes the amount of such materials used.
Reel-to-reel plating system for connectors, smart cards, flexible circuits and metal coils
The plating system transports the connectors through the entire plating process in a controlled manner. The entire process is controlled and monitored by a centralized system using software developed in-house.
Semiconductor
Tin plating system – Carrier holders
This plating system handles lead frames in a strip form. A specially designed mechanical strip carrier holds the individual strips which are transported through the individual stages of the plating process. The strips which are housed in a storage magazine, are automatically loaded onto the carrier and unloaded back to the magazine upon the completion of the plating process. The system is designed to prevent droppage of strips during the process.
Tin Plating system – Carrier Belt
The carrier belt system designed to significantly reduce the use of chemicals, compressed air and water in the process whilst minimizing the cross contamination between process baths. Such contamination is caused by “drag” chemicals carried by the strips and carrier from one bath to another during the process. The system can be integrated with electrolytic deflashing as an option.
Automotive
Nickel plating system
This plating system handles product in a strip form. A specially designed mechanical strip carrier holds the individual products which are sent through the individual phases of the plating process. The products which are housed in a storage magazine, are automatically loaded onto the holder and unloaded back to the magazine upon the completion of the plating process. The system is designed to prevent droppage of products during the process.
