Deflashing is a process used to remove excess molding compound around the package or on the leadframe caused by leakage during the encapsulation process. During the encapsulation of devices, wear and tear of the encapsulation mold and/or variations in the lead frames cause small quantities of molding compound or resin to leak out. This excess material around the body of the package or thin film on the lead frame or lead (referred to as flashes and resin bleeds) has to be removed by a deflashing process after the molding but prior to the tin plating or dipping processes.
We offer a range of deflashing systems using various techniques:-
Wet Blasting
Wet blasting employs a slurry mixture of water, compressed air and abrasive materials delivered at high velocity to deflash the parts. The system is dust free and delivers a high level of cleanliness without causing any static induced damage. However, this process is expensive as a combination of different materials has to be used and waste slurry material has to be disposed. The system also cannot be used for thin or high pin count devices.
Chemical Deflashing
Chemical deflashing involves soaking parts in a chemical bath to loosen the resin bleeds from the molded lead frame. The parts are thereafter rinsed with water. The loosened resin bleeds are removed by blasting with high-pressure water jets. Though this technique is effective, there are fears that the chemicals used could degrade the device. Caution is also needed in the treatment of the chemicals used prior to its disposal.
Electrolytic Deflashing
Electrolytic deflashing is similar to chemical deflashing. It involves the soaking of the parts in a chemical bath where a current is employed to create an electrolytic effect, which softens and loosens the resin bleed. Following rinsing with water, the loosened resin bleeds are removed by blasting with high-pressure water jets. The system is designed for handling of products in vertical/horizontal and in strip/panel configurations.
