We supply a range of inspection equipment capable of automated vision inspection for integrated circuits in marking and packaging processes. The system can be integrated with laser marking and lead inspection with lead conditioning and tape & reel packing.
VT-1100
- Fully automated of 3D vision inspection system
- High throughput up to 45,000 UPH
- In-pocket check
- 3D “On-The-Fly” lead ball/pad inspection
- Integrated with mark inspection module
- User-defined output: tray-to-tray or tray-to-tape dual taper output
- Small footprint design
- Solution for BGA, QFN, QFP packages (JEDEC thin trays)
UT-300
- Fully automatic transfer machine
- User-defined input/output tray-to-tube or tube-to-tray
- High throughput up to 4,500 UPH
- ID Matrix Decoder – to determine “good” or “bad” devices
- Shutter station - to flipped devices & shuttered in two different buffer tracks position
- Pick & place module with orientation module
- Incline tracks with air assist module (for tray-to-tube operation)
- Solution for TSSOP, SSOP, SOIC packages
