Lead conditioning was introduced to improve the yield of the device. In an integrated circuit production, leads may be damaged during handling and processing. Such damaged devices would be discarded without lead conditioning. Lead conditioning systems restore the condition of the lead to its original specifications.
We supply a range of lead conditioning systems with programmable single or multiple stations for re-working different types of packages.
R-330/330T
- Fully automated standalone rework station
- User-defined input/output tray-to-tray or tube-to-tube
- High throughput up to 550 UPH
- Use of servo motor controller for rework – minimize conversion time
- Rotary arm module – to maximize production time
- Dynamic Precisor module – ensure no stoppage and achieve error free productivity
- Lead conditioning capabilities: - lead bent, pitch, sweep, skew, copplanarity, package standoff, terminal dimension
- Solution for QFP, TQFP, PQFP,TSOP packages (stacked in JEDEC or EIAJ trays)
R-320
- Fully automated standalone rework station
- High throughput of 800 UPH
- Lead conditioning capabilities: – lead bent, standoff, coplanarity, sweep, pitch, skew, terminal dimension
- Dynamic precisor module – ensure no stoppage and achieve error free productivity
- Mechanical incoming jig lead inspection – ensure rework capabilities
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Solution for PGA & μPGA packages (in JEDEC trays)
R-300
- Semi-automated lead conditioning single tube input machine
- Manual dual tube output station
- High throughput of 1,200 UPH
- Lead conditioning capabilities: – lead bent, standoff, coplanarity, sweep, pitch, skew, terminal dimension
- Solution for TSSOP, SOIC packages (in tube form)
