AGS offers total plating solutions for electroplating of solder/pure tin of lead frame in semiconductor and nickel of components in automotive industries.
Semiconductor and Automotive
Carrier Holders System
This plating system handles products in a strip form. A specially designed mechanical strip carrier holds the individual products which are transported through the individual stages of the plating process. The products which are housed in a storage magazine, are automatically loaded onto the carrier and unloaded back to the magazine upon the completion of the plating process. The system is designed to prevent droppage of products during the process.
S2S-3000CC
- High speed strip handling
- Fully enclose for safe and clean environment
- Continuous movement conveyor belt system
- Fully computerized touch screen control system
- Belt speed of 8m/min
- Handling most of strip packages with leaded and leadless package in EOL magazine/slotted magazine
Semiconductor
Carrier Belt System
A carrier belt system designed to significantly reduce the usage of chemicals, compressed air and water in the process whilst minimizing the cross contamination between process baths. Such contamination is caused by “drag” chemicals carried by the strips and carrier from one bath to another during the process. The system can be integrated with electrolytic deflashing as an option.
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S2S-3000
- High speed strip handling
- Fully enclose for safe and clean environment
- Continuous movement conveyor belt system
- Fully computerized touch screen control system
- Belt speed of 8m/min
- Handling most of strip packages with leaded and leadless package in EOL magazine/slotted magazine
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