We supply a range of packaging equipment which is integrated with laser marking and lead inspection with conditioning.
UT-300
- Fully automatic transfer machine
- User-defined input/output tray-to-tube or tube-to-tray
- High throughput up to 4,500 UPH
- ID Matrix Decoder – to determine “good” or “bad” devices
- Shutter station – to flipped devices & shuttered into two different buffer tracks position
- Pick & place module with orientation module
- Incline tracks with air assist module (for tray-to-tube operation)
- Solution for TSSOP, SSOP, SOIC packages
TNR-330
- Fully automatic transfer machine
- Input tray-to-tape & reel
- High throughput up to 7,000 UPH
- 2D In-pocket mark inspection
- Implied/Gross lead Inspection
- Single or dual tape & reel module
- New sealing module
- SPC reporting
- Dual pick & place arm
- Auto reject replaced
- Optional module: de-taping module & barcode reader
- Solution for BGA, QFN, QFP in JEDEC trays
